Designed for high-precision surface mount applications, YF-6R-305 is a general-purpose lead-free solder paste with excellent performance for high-speed printing and placement. With good welding activity, the solder joints are bright and full, and good soldering effects can be obtained for QFP, SOIC, TSSOP, QFP, BGA and other devices.
YF-6R-305 has a wide reflow window and can adapt to a variety of reflow profiles, thus ensuring good and consistent soldering results for solder joints at different endotherms, especially for large PCBs.
YF-6R-305 has better application stability than previous products. Under normal conditions of use (20-25 ° C, RH 30-60%), the viscosity and viscosity will not change significantly after 12 hours of continuous printing, even in the harsh Good printing and soldering properties are also maintained in the environment.
After the product is reflowed, the residue is non-corrosive, colorless and transparent, and does not need to be cleaned.